ForTii? LDS81
Polyamide 4T
產(chǎn)品說(shuō)明:
35% Glass Reinforced, Laser Direct Structuring (LDS)
Special Features:
Used In:
ForTii? is a breakthrough high temperature polyamide with halogen-free flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii? in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want €" and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.
填料/增強(qiáng)材料 | 玻璃纖維增強(qiáng)材料, 35% 填料按重量
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添加劑 | |
用途 | |
加工方法 | |
樹脂ID (ISO 1043) | |
密度 | 1.57 | -- | g/cm3 | ISO 1183 |
吸水率 (平衡, 73°F, 50% RH) | 1.7 | -- | % | ISO 62 |
拉伸模量 | 1.81E+6 | 1.81E+6 | psi | ISO 527-2 |
拉伸應(yīng)力 (斷裂) | 18900 | 18900 | psi | ISO 527-2 |
拉伸應(yīng)變 (斷裂) | 1.2 | 1.2 | % | ISO 527-2 |
彎曲模量 | 1.74E+6 | -- | psi | ISO 178 |
彎曲應(yīng)力 | 31900 | -- | psi | ISO 178 |
簡(jiǎn)支梁缺口沖擊強(qiáng)度 (73°F) | 1.9 | 1.9 | ft·lb/in2 | ISO 179/1eA |
熱變形溫度 |
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66 psi, 未退火 | 599 | -- | °F | ISO 75-2/B |
264 psi, 未退火 | 572 | -- | °F | ISO 75-2/A |
玻璃轉(zhuǎn)化溫度 2 | 257 | -- | °F | ISO 11357-2 |
熔融溫度 2 | 617 | -- | °F | ISO 11357-3 |
線形熱膨脹系數(shù) |
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| ASTM D696 |
流動(dòng) | 1.4E-5 | -- | in/in/°F |
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橫向 | 2.5E-5 | -- | in/in/°F |
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體積電阻率 | > 1.0E+15 | > 1.0E+15 | ohms·cm | IEC 60093 |
介電強(qiáng)度 | 660 | 660 | V/mil | IEC 60243-1 |
相對(duì)電容率 (1.00 GHz) | 4.00 | -- |
| IEC 60250 |
可燃性等級(jí) (0.03 in) | HB | -- |
| IEC 60695-11-10, -20 |
干燥溫度 | 212 | °F |
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干燥時(shí)間 | 2.0 | hr |
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料筒后部溫度 | 608 到 626 | °F |
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料筒中部溫度 | 617 到 635 | °F |
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料筒前部溫度 | 626 到 635 | °F |
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射嘴溫度 | 626 到 635 | °F |
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加工（熔體）溫度 | 626 到 644 | °F |
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模具溫度 | 212 到 302 | °F |
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注射速度 | 中等偏快 |
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背壓 | 72.5 到 435 | psi |
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螺桿壓縮比 | 2.5:1.0 |
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